Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

Laser-assisted thermoplastic tape laying can be used for the automated, eco-friendly production of lightweight, highperformance structural components in a variety of industries such as aerospace and ...

The advent of laser-assisted techniques in the debonding of ceramic materials has ushered in a new era in restorative and orthodontic dentistry. This innovative approach utilises various laser systems ...

Scientists from the University of New South Wales (UNSW) in Australia have investigated how effectively the laser-assisted firing process developed by Chinese solar module manufacturer Jolywood, the ...