BE Semiconductor Industries is a key player in die-attach and packaging equipment, critical for advanced chip manufacturing. BESIY benefits from AI-driven chip demand and leads in advanced die attach ...

Applied Materials and Lam Research supply the essential factory tools required to build the advanced processors driving the ...

Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging technologies is ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

AI chips required by generative AI rely on finely wired and processed equipment; thus, front-end process equipment manufacturers have shifted their focus to the advanced packaging solutions market as ...

Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027.

Global sales of equipment for semiconductor manufacturing by original equipment manufacturers (OEMs) is forecast to reach a ...

TSMC is accelerating fab construction and equipment deliveries after Jensen Huang's Taiwan visit highlighted relentless AI ...

Dutch chip gear maker ASML has lifted the kimono its Twinscan XT:260, a new lithography scanner built for the brave new world of 3D chip packaging. The outfit claims that it is the first machine of ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...